Thermal Management Expo

As the demand for complex computational workloads continues to rise, effective thermal management has never been more essential. Join us at this year’s event to discover how Thermal Interface Material 1.5 (TIM 1.5) is transforming the thermal management landscape for Electric Vehicles (EV) and Artificial Intelligence (AI) systems.

Suburban Collection Showplace, Novi, Michigan, USA

Apr 29 - Apr 30, 2025 / Booth# 508

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Panel discussion:

Solving Thermal Challenges in Next-Gen Chips Development for AI and Automotive

Honeywell panelist:

Wade Jensen, General Manager, Honeywell Thermal Solutions

April 30, 11.30 AM

As we witness parallel advancements in both artificial intelligence and electric vehicles, the critical role of innovative thermal management solutions becomes increasingly apparent. In AI systems, where processors demand high efficiency and reliability, technologies like TIM 1.5 are vital for maintaining optimal operational temperatures to support complex algorithms and data processing tasks. Similarly, in the context of electric vehicles, efficient thermal management not only maximizes battery performance but also ensures safety and longevity.

This session will examine innovative packaging techniques, semiconductor solutions and advanced thermal interface materials like Honeywell PCM, which are designed to:

Optimize thermal performance by reducing interface contact resistance and allowing heat to move more freely and efficiently from the chip to the heat sink.
Improve reliability by reducing the likelihood of thermal-induced device failure
Simplify the assembly process

Engage with us

Be part of the conversation around TIM 1.5 and its transformative impact on the future of EV and AI applications. Visit us at Booth #508 to explore the features, benefits, and characteristics that make TIM 1.5 essential in enhancing system performance and reliability.

Optimizing AI Systems with TIM 1.5

The demand for high-performance computing drives the development of TIM 1.5, which effectively manages heat from AI processors and GPUs. Used primarily between bare flip chip dies and heat sinks, TIM 1.5 enhances thermal conductivity and reduces contact resistance.

Application Note

As the automotive industry pivots to electric and hybrid vehicles, the thermal challenges associated with battery management systems and power electronics necessitate innovative solutions. This paper explores how Phase Change Materials (PCMs) can be optimized for thermal stability and efficiency, particularly in extreme operating conditions.

Learn More

Thermal Management Solutions

Discover our comprehensive Thermal Management products brochure, featuring essential information on our product selection guide, phase change materials, thermal gap fillers, insulators, and more.

Download Brochure

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