Semi Therm

Join us at this year’s event to discover how Thermal Interface Material 1.5 (TIM 1.5) is transforming the thermal management landscape for artificial intelligence (AI) systems. As the demand for complex computational workloads continues to rise, effective thermal management has never been more essential.

Double Tree by Hilton, 2050 Gateway Place, San Jose, California

Mar 10 - Mar 14, 2025 / Booth # 303

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Workshop:
Beat the heat with TIM 1.5

Speaker:
Av Kerkar, Sr. R&D Director, Honeywell Semiconductor Materials
March 12, 3.00 PM

As we witness parallel advancements in both artificial intelligence and electric vehicles, the critical role of innovative thermal management solutions becomes increasingly apparent. In AI systems, where processors demand high efficiency and reliability, technologies like TIM 1.5 are vital for maintaining optimal operational temperatures to support complex algorithms and data processing tasks. Similarly, in the context of electric vehicles, efficient thermal management not only maximizes battery performance but also ensures safety and longevity.

The interplay of thermal solutions in both domains highlights the importance of TIM 1.5 and its potential to revolutionize performance outcomes across various applications—addressing the challenges and meeting the evolving needs of the industry.

The key insights covered in this session include:

AI and EV industry trends and the effectiveness of TIM 1.5 for better thermal conductivity and efficient heat dissipation in powerful semiconductors in highly demanding applications
Introduction to Phase Change Materials (PCM) and their potential to mitigate particle issues and warpage-induced changes in bond-line thickness
Analysis of test results conducted on PCMs, evaluating their thermal stability and mechanical integrity under varied temperatures

Engage with Us!
We invite you to join us for in-depth discussions and insights on how TIM 1.5 can revolutionize your thermal management strategies. Whether you're an electronic device manufacturer, an AI systems developer, or simply curious about the advancements in thermal interface materials, we have something for everyone.

Don’t Miss This Opportunity!
Be part of the conversation around TIM 1.5 and its transformative impact on the future of AI applications. Visit us at Booth #303 to explore the features, benefits, and characteristics that make TIM 1.5 an essential component in enhancing system performance and reliability.

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Optimizing AI Systems with TIM 1.5

The demand for high-performance computing drives the development of TIM 1.5, which effectively manages heat from AI processors and GPUs. Used primarily between bare flip chip dies and heat sinks, TIM 1.5 enhances thermal conductivity and reduces contact resistance.

Application Note

Thermal Management Solutions

Discover our comprehensive Thermal Management products brochure, featuring essential information on our product selection guide, phase change materials, thermal gap fillers, insulators, and more.

Download Brochure